Monday, May 11, 2020

[MasterDegree] Pasca Sarjana Telkom University Scholarship Program 2020, Indonesia

Telkom University Postgraduate program opens several master programs, namely Masters in Management, Masters in Informatics, Masters in Telecommunications Engineering, and Masters in Industrial Engineering in Bandung, West Java. Through this program, students can further explore science according to their fields and abilities.

Graduate Study Program:

Faculty of Economics and Business (FEB):

Master of Management Study Program

Faculty of Electrical Engineering (FTE):

Master of Electrical Engineering - Telecommunications Study Program

Faculty of Informatics (FIF):

Master of Informatics Study Program

Faculty of Industrial Engineering (FRI):

Master of Industrial Engineering Study Program

Faculty of Creative Industries (FIK):

Master of Design Study Program

Fast Track Scholarship Program
The Fast Track Scholarship Program is valid for Telkom University undergraduate students who are currently studying and have completed their 6th semester. By joining the Fast Track Scholarship Program, you can pass the S1 and S2 Programs in just 5 years. This Telkom University S2 scholarship scheme is valid after graduating from S1.

25% scholarship

For MM MM Study Programs: GPA S1 3.00 to 3.49
For S2 Engineering Study Program: S1 GPA 2.75-3.24

50% scholarship

For MM MM Study Programs: GPA S1 ≥ 3,50
For Engineering S2 Study Programs: GPA S1 ≥ 3.25

Alumni Scholarship Program"
The alumni scholarship program applies to all Telkom University alumni including STT Telkom / ITT Telkom, STMB Telkom / IM Telkom, STISI Telkom.

25% scholarship

For MM MM Study Programs: GPA S1 3.00 to 3.49
For S2 Engineering Study Program: S1 GPA 2.75-3.24
For S2 Design Study Program: S1 GPA from 3.00 to 3.24

50% scholarship

For MM MM Study Programs: GPA S1 ≥ 3,50
For Engineering S2 Study Programs: GPA S1 ≥ 3.25
For Design Study Programs: GPA S1 ≥ 3.25

Blended Learning Scholarship 25%

For MM MM Study Programs: GPA S1 ≥ 3,5; TOEFL: ≥ 500 / IELTS 5.5; TPA: 500
For Engineering S2 Study Programs: S1 GPA: ≥ 3.25; TOEFL: ≥ 500 / IELTS 5.5; TPA: 500

Requirement:

Attach S1 diploma
Attach the transcript of S1 value
Has a BAPPENAS TPA certificate with a score of ≥ 450
Have a TOEFL ITP / EPRT certificate with a score of ≥ 450
Attach a thesis plan proposal
Following the interview

Specific Requirement:

For Engineering study program applicants: take the Expertise Potential Test (TPK)
For S2 Design Management applicants: TPA TOEFL ≥ 400

How to Apply:

Create an account at smb.telkomuniversity.ac.id, check email, click activation
Fill in the complete biodata, prepare photo softcopy, diploma, transcript, recommendation letter, BAPPENAS TPA score and TOEFL
Check the transaction number that will be used to pay the registration fee
Buy PIN Rp. 400,000 through BNI / Mandiri
PIN code activation on the smb.telkomuniversity.ac.id web
Print the participant card and be present according to the selection schedule